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High Performance Polymers

Volumn 13, Issue 3, 2001, Pages 79-100

Chemistries for high reliability in electronics assemblies

(3) Herr, Donald E a Nikolic, Nikola A a Schultz, Rose Ann b

a NATIONAL STARCH AND CHEMICAL COMPANY (United States)

b Emerson and Cuming Company (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; DIFFUSION; ENCAPSULATION; ENVIRONMENTAL IMPACT; EPOXY RESINS; ESTERS; RELIABILITY;

ELECTRONICS ASSEMBLIES;

ELECTRONICS PACKAGING;

EID: 0035442858 PISSN: 09540083 EISSN: None Source Type: Journal
DOI: 10.1088/0954-0083/13/3/302 Document Type: Conference Paper

Times cited : (21)

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