Effects of temperature and loading rate on the shear strength and shear yield stress of lead-free 97Cu-3Sn and 95.5Cu-4Sn-0.5Ag solder alloys

Journal of Materials Science Letters

Volumn 20, Issue 17, 2001, Pages 1585-1587

  Unal O ^a   Foley, J C ^a  

^a IOWA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTIVITY; SHEAR STRENGTH; SHEAR STRESS; SOLDERING; STATISTICAL METHODS; THERMAL EFFECTS;

THERMOMECHANICAL LOADING;

SOLDERING ALLOYS;

EID: 0035438709     PISSN: 02618028     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1017908718111     Document Type: Article

References (6)