Thermal contact resistance between high-Tc superconductor and copper

Physica C: Superconductivity and its Applications

Volumn 357-360, Issue SUPPL. 2, 2001, Pages 785-788

  Fujishiro, H ^a   Okamoto, T ^a   Hirose, K ^a  

^a IWATE UNIVERSITY   (Japan)

Author keywords

Adhesives; Superconducting connection; Thermal contact resistivity; Thermal diffusivity

Indexed keywords

COPPER; EPOXY RESINS; HEAT RESISTANCE; INTERFACES (MATERIALS); PLASTIC ADHESIVES; SILVER; THERMAL DIFFUSION IN SOLIDS; VARNISH;

THERMAL CONTACT RESISTANCE;

HIGH TEMPERATURE SUPERCONDUCTORS;

EID: 0035423151     PISSN: 09214534     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-4534(01)00364-1     Document Type: Article

References (5)