Microstructure and hardness of copper powders consolidated by plasma pressure compaction

Journal of Materials Engineering and Performance

Volumn 10, Issue 4, 2001, Pages 449-455

  Srivatsan, T S ^a   Ravi, B G ^a   Naruka, A S ^a   Riester, L ^a   Yoo, S ^a   Sudarshan, T S ^a  

^a University of Akron   (United States)

Author keywords

Copper powders; Hot isostatic pressing; Pressure compaction

Indexed keywords

COMPACTION; CONSOLIDATION; ELECTRIC FIELDS; METALLOGRAPHIC MICROSTRUCTURE; MICROHARDNESS; PLASMA APPLICATIONS; THERMAL EFFECTS;

ELECTRICAL PULSE; GRAIN COARSENING; NANOHARDNESS; PLASMA PRESSURE COMPACTION; POWDER PARTICLES;

COPPER POWDER;

EID: 0035422332     PISSN: 10599495     EISSN: None     Source Type: Journal    
DOI: 10.1361/105994901770344872     Document Type: Article

References (11)