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Volumn 41, Issue 8, 2001, Pages 1193-1201
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Failure analysis from the back side of a die
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Author keywords
[No Author keywords available]
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Indexed keywords
ATOMIC FORCE MICROSCOPY;
DEFECTS;
FAILURE ANALYSIS;
FLIP CHIP DEVICES;
GATES (TRANSISTOR);
PHOTOEMISSIVE DEVICES;
PROBES;
SILICON;
LEAD-ON-CHIP DIES;
PHOTOEMISSION MICROSCOPES (PEM);
DIES;
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EID: 0035416581
PISSN: 00262714
EISSN: None
Source Type: Journal
DOI: 10.1016/S0026-2714(01)00106-8 Document Type: Article |
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Times cited : (6)
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References (6)
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