Grain-Size Effect on Compressive Creep of Silicon-Carbide-Whisker-Reinforced Aluminum Oxide

Journal of the American Ceramic Society

Volumn 84, Issue 7, 2001, Pages 1645-1647

  De Arellano López, Antonio R ^a   Meléndez Martínez, Juan J ^a   Domínguez Rodríguez, Arturo ^a   Routbort, Jules L ^b   Lin, Hua Tay ^c   Becher, Paul F ^c  

^a UNIVERSITY OF SEVILLE   (Spain)

^b ARGONNE NATIONAL LABORATORY   (United States)

^c OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); COMPRESSIVE STRESS; CREEP; CRYSTAL WHISKERS; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MECHANICAL VARIABLES MEASUREMENT; PLASTIC DEFORMATION; SILICON CARBIDE; STRAIN RATE;

COMPRESSIVE CREEP; DIFFUSIONAL CONTROLLED CREEP; DIFFUSIONAL PROCESS CONTROL; LIFTSHITZ AND RACHINGER SLIDING;

ALUMINA;

EID: 0035413135     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1151-2916.2001.tb00892.x     Document Type: Article

References (10)

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