Chemical stresses induced by grain-boundary diffusion in thin films

Journal of Materials Research

Volumn 16, Issue 7, 2001, Pages 1967-1974

  Wang, W L ^a   Chou, Y T ^b   Lee, Sanboh ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPACTION; GRAIN BOUNDARIES; STRESS ANALYSIS; STRESS CONCENTRATION; TENSILE TESTING; THICKNESS MEASUREMENT;

CHEMICAL STRESSES; GRAIN BOUNDARY DIFFUSION;

THIN FILMS;

EID: 0035410793     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2001.0269     Document Type: Article

References (27)