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Volumn 16, Issue 4, 2001, Pages 483-502
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Fabrication and characterization of Cu-SiCp composites for electrical discharge machining applications
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Author keywords
Copper based composite; Density; Electrical discharge machining; Electrical resistivity; Electrode wear ratio; Electroless copper plating; Fracture surface; Hardness; Material removal rate; Metal matrix composite; Porosity; Powder metallurgy; Silicon carbide; Tensile strength; Thermal expansion coefficient
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Indexed keywords
COPPER;
ELECTRIC DISCHARGE MACHINING;
ELECTRIC PROPERTIES;
ELECTROLESS PLATING;
EXTRUSION;
HARDNESS;
MIXING;
POWDER METALLURGY;
SILICON CARBIDE;
SINTERING;
TENSILE STRENGTH;
WEAR OF MATERIALS;
COPPER BASED COMPOSITE;
ELECTRODE WEAR RATIO;
MATERIAL REMOVAL RATE;
COMPOSITE MATERIALS;
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EID: 0035409936
PISSN: 10426914
EISSN: None
Source Type: Journal
DOI: 10.1081/AMP-100108522 Document Type: Article |
Times cited : (43)
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References (34)
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