Enhancement of electronic cooling by insertion of foam materials

Heat and Mass Transfer/Waerme- und Stoffuebertragung

Volumn 37, Issue 4-5, 2001, Pages 371-378

  Rachedi, R ^a   Chikh, S ^a  

^a UNIVERSITY OF SCIENCES AND TECHNOLOGY HOUARI BOUMEDIENE   (Algeria)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION; FINITE DIFFERENCE METHOD; FOAMED PRODUCTS; POROUS MATERIALS; REYNOLDS NUMBER; SUBSTRATES; TEMPERATURE MEASUREMENT; THERMAL CONDUCTIVITY;

FOAM MATERIALS;

COOLING SYSTEMS;

EID: 0035395777     PISSN: 09477411     EISSN: None     Source Type: Journal    
DOI: 10.1007/s002310100192     Document Type: Article

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