Numerical analysis on the cooling of a laser diode package with a thermoelectric cooler

Heat Transfer - Asian Research

Volumn 30, Issue 5, 2001, Pages 357-370

  Lee, Hee Jin ^a   Yoon, Joon Shik ^a   Kim, Charn Jung ^a  

^a Seoul National University   (South Korea)

Author keywords

Laser diode package; Numerical analysis; Thermoelectric cooler; Three dimensional model

Indexed keywords

BOUNDARY CONDITIONS; COOLING; HEAT TRANSFER; INERT GASES; LIGHT EMITTING DIODES; LIGHT TRANSMISSION; THERMAL EXPANSION; THERMAL INSULATION; THERMOELECTRIC EQUIPMENT; THERMOELECTRICITY;

THERMOELECTRIC COOLERS (TEC);

SEMICONDUCTOR LASERS;

COOLING; DIODE; HEAT TRANSFER; LASER; MATHEMATICAL ANALYSIS; REFRIGERATOR;

EID: 0035394187     PISSN: 10992871     EISSN: None     Source Type: Journal    
DOI: 10.1002/htj.1023     Document Type: Article

References (5)

1. Simultaneous determination of the thermal diffusivity of semiconductor lasers and resistance of their adhesive joints
2. A study on the cooling performance of thermoelectric module