Trench etch processes for dual damascene patterning of low-k dielectrics

Journal of Vacuum Science and Technology, Part A: Vacuum, Surfaces and Films

Volumn 19, Issue 4, 2001, Pages 1388-1391

  Jiang, P ^a   Celii, F G ^a   Dostalik, W W ^a   Newton, K J ^a   Sakima, H ^b  

^a TEXAS INSTRUMENTS   (United States)

^b TOKYO ELECTRON AMERICA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANTIREFLECTION COATINGS; COMPUTER SIMULATION; COPPER; DEFECTS; DIELECTRIC MATERIALS; PLASMA APPLICATIONS; SCANNING ELECTRON MICROSCOPY; SPUTTERING;

DUAL DAMASCENE PATTERNING; TRENCH ETCH;

ETCHING;

EID: 0035393610     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1380717     Document Type: Article

References (7)