Advanced thermal tester for accurate measurement of internal thermal resistance of high power electronic modules

IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 2, 2001, Pages 226-231

  Sikka, K K ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

Electronics cooling; Interface materials; Internal thermal resistance; Thermal measurements

Indexed keywords

DATA ACQUISITION; HEAT LOSSES; HEAT RESISTANCE; INTERFACES (MATERIALS); MOUNTINGS; POWER ELECTRONICS; WATER COOLING SYSTEMS;

THERMAL TESTERS;

THERMAL VARIABLES MEASUREMENT;

EID: 0035363426     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.926387     Document Type: Article

References (8)

1. Use of experimental data in guiding thermal specification development
2. Thermal characteristics of a card-on-board electronic package
3. Low speed wind tunnel testing
4. Effects of package orientation and mixed convection on heat transfer from a PQFP
5. Efficient heat transfer approximation for the chip-on-substrate problem
6. Describing uncertainties in single-sample experiments