Chemical-mechanical planarization of Cu and Ta

JOM

Volumn 53, Issue 6, 2001, Pages 50-52

  Babu, S V ^a   Jindal, A ^a   Li, Y ^b  

^a CLARKSON UNIVERSITY   (United States)

^b IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; ALUMINA; COPPER; PERMITTIVITY; SILICA; TANTALUM;

CHEMICAL MECHANICAL PLANARIZATION; SINGLE SILICON CHIP;

MICROELECTRONIC PROCESSING;

EID: 0035359294     PISSN: 10474838     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11837-001-0104-x     Document Type: Article

References (15)