Processing and evaluation of graded SiC/Cu facing plasma composite

Beijing Keji Daxue Xuebao/Journal of University of Science and Technology Beijing

Volumn 23, Issue 3, 2001, Pages 257-

  Ling, Y H ^a   Li, J T ^a   Ge, C C ^a  

^a NONE

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EID: 0035356258     PISSN: 1001053X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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