High deposition rate of aluminum oxide film by off-plane double bend filtered cathodic vacuum arc technique

Thin Solid Films

Volumn 386, Issue 1, 2001, Pages 1-5

  Choong, Y S ^a   Tay, B K ^a   Lau, S P ^a   Shi, X ^a   Cheng, Y H ^a  

^a Sch Elec Electron Eng   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; ELECTRIC ARCS; ELECTRIC CURRENTS; OXYGEN; PARTIAL PRESSURE; PHYSICAL VAPOR DEPOSITION; PLASMA APPLICATIONS; STOICHIOMETRY;

OFF-PLANE DOUBLE BEND FILTERED CATHODIC VACUUM ARC TECHNIQUE (FCVA);

VACUUM DEPOSITED COATINGS;

EID: 0035341772     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(00)01878-2     Document Type: Article

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