Environmentally friendly wafer production: NF3 remote microwave plasma for chamber cleaning

Microelectronic Engineering

Volumn 56, Issue 1-2, 2001, Pages 73-76

  Reichardt, H ^a   Frenzel, A ^a   Schober, K ^b  

^a DAS GmbH   (Germany)

^b SILTRONIC AG   (Germany)

Author keywords

Abatement; F2; NF3; Operating costs; Remote microwave plasma

Indexed keywords

CHEMICAL CLEANING; DECOMPOSITION; ENVIRONMENTAL PROTECTION; GLOBAL WARMING; PLASMA APPLICATIONS; PROCESS ENGINEERING; PRODUCTION ENGINEERING;

REMOTE MICROWAVE PLASMAS;

SILICON WAFERS;

EID: 0035341559     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(00)00505-0     Document Type: Article

References (2)

1. M.A. Lester, Semicond. Int. 23 (1) (2000) 46.
2. K.A. Aitchison, Semiconductor Fabtech, ICG Publishing, London, 11th Edition, 2000, p. 87.