Integration of high voltage devices on thick SOI substrates for automotive applications

Solid-State Electronics

Volumn 45, Issue 4, 2001, Pages 629-632

  Heinle, U ^a   Olsson, J ^a  

^a UPPSALA UNIVERSITY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC DEVICES; INTEGRATED CIRCUIT LAYOUT; SEMICONDUCTOR DIODES; SUBSTRATES; TRANSISTORS;

DEEP TRENCH TECHNOLOGY;

SILICON ON INSULATOR TECHNOLOGY;

EID: 0035333692     PISSN: 00381101     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0038-1101(01)00085-5     Document Type: Article

References (5)

1. High voltage thin layer devices (RESURF devices)
2. Variation of lateral doping as a field terminator for high-voltage power devices
3. State of the art silicon etching on silicon-on - Insulator substrates for dielectric isolation and MEMS applications