|
|
Volumn 20, Issue 9, 2001, Pages 835-837
|
|
Precipitation kinetics in the Cu-5%Al alloy with silver additions, studied by electrical resistivity measurements
a a a a |
|
Author keywords
[No Author keywords available]
|
|
Indexed keywords
ADDITION REACTIONS;
AGING OF MATERIALS;
ANNEALING;
CONCENTRATION (PROCESS);
DISSOLUTION;
ELECTRIC CONDUCTIVITY MEASUREMENT;
GRAIN BOUNDARIES;
HIGH TEMPERATURE PROPERTIES;
PRECIPITATION (CHEMICAL);
QUENCHING;
SCANNING ELECTRON MICROSCOPY;
SILVER;
BACKSCATTERED ELECTRON IMAGING;
PRECIPITATES;
COPPER ALLOYS;
|
|
EID: 0035328877
PISSN: 02618028
EISSN: None
Source Type: Journal
DOI: 10.1023/A:1010910712966 Document Type: Article |
|
Times cited : (6)
|
|
References (6)
|
