Boron Nitride-Aluminum Nitride Ceramic Composites Fabricated by Transient Plastic Phase Processing

Journal of the American Ceramic Society

Volumn 84, Issue 4, 2001, Pages 887-889

  Cheng, Jihong ^a   Zeng, Zhaoqiang ^a   Wu, Chongjun ^a   Hu, Xiaoqing ^a   Miao, Hezhuo ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COMPOUNDS; ALUMINUM NITRIDE; BENDING STRENGTH; CUBIC BORON NITRIDE; DENSITY (SPECIFIC GRAVITY); FIELD EMISSION MICROSCOPES; MECHANICAL PROPERTIES; SCANNING ELECTRON MICROSCOPY; SINTERING; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL EXPANSION; X RAY CRYSTALLOGRAPHY;

THERMAL EXPANSION COEFFICIENT; TRANSIENT PLASTIC PHASE PROCESSING;

CERAMIC MATRIX COMPOSITES;

EID: 0035324347     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1151-2916.2001.tb00761.x     Document Type: Article

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