Non-destructive evaluation of delamination in ceramic thin films on metal substrates by scanning electron microscopy

Thin Solid Films

Volumn 385, Issue 1-2, 2001, Pages 22-28

  Rangarajan, Srinivasan ^a   King, Alexander H ^b  

^a STONY BROOK UNIVERSITY   (United States)

^b PURDUE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CRACK INITIATION; DELAMINATION; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRIC INSULATING MATERIALS; INTERFACES (MATERIALS); NONDESTRUCTIVE EXAMINATION; QUENCHING; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; THIN FILMS;

CERAMIC THIN FILMS; METAL SUBSTRATES;

CERAMIC MATERIALS;

EID: 0035312081     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(00)01904-0     Document Type: Article

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