Extreme negative rake angle technique for single point diamond nano-cutting of silicon

Precision Engineering

Volumn 25, Issue 2, 2001, Pages 165-167

  Patten, John A ^a   Gao, Wei ^b  

^a UNIVERSITY OF NORTH CAROLINA AT CHARLOTTE   (United States)

^b TOHOKU UNIVERSITY   (Japan)

Author keywords

Ductile; Rake angle; Silicon; Single point diamond machining; Tool geometry

Indexed keywords

BRITTLENESS; DIAMOND CUTTING TOOLS; DUCTILITY; SINGLE CRYSTALS;

SINGLE POINT DIAMOND MACHINING;

SILICON;

EID: 0035311678     PISSN: 01416359     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0141-6359(00)00072-6     Document Type: Article

References (7)

1. Diamond cutting of silicon with nanometric finish
2. Effect of tool edge geometry on the nanometric cutting of Ge
3. Cutting tool edge radius, and depth of cut influence on the generation of the high pressure phase transformation during ductile machining
4. Grinding performance in repeated reversal of grind wheel direction during grinding cycle
5. Brittle-ductile transition behavior in diamond turning of single crystal silicon using straight nosed tools