Finite element simulation of thermal fatigue in multilayer structures: Thermal and mechanical approach

Microelectronics Reliability

Volumn 41, Issue 4, 2001, Pages 517-523

  Rodriguez, M P ^a   Shammas, N Y A ^a  

^a STAFFORDSHIRE UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; COMPUTER SIMULATION; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); MULTILAYERS; SEMICONDUCTOR DEVICE MODELS; STRESS ANALYSIS; SURFACE MOUNT TECHNOLOGY; THERMAL EXPANSION; THERMAL STRESS;

MECHANICAL FINITE ELEMENT MODELS; SOFT SOLDER INTERFACES;

MICROELECTRONICS;

EID: 0035310963     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(00)00256-0     Document Type: Article

References (6)

1. The stresses in cemented joints
2. Thermal stresses in bonded joints
3. Static and dynamic finite element modelling of thermal fatigue effects in IGBT modules