Analyses of thermal stress and fracture during cryopreservation of blood vessel

Science in China, Series E: Technological Sciences

Volumn 44, Issue 2, 2001, Pages 158-163

  Hua, Zezhao ^a   Xu, Hongyan ^a   Zhou, Guoyan ^a   Liu, Jinfen ^b   Huang, Huimin ^b   Ding, Wenxiang ^b  

^a UNIVERSITY OF SHANGHAI FOR SCIENCE AND TECHNOLOGY   (China)

^b SHANGHAI JIAO TONG UNIVERSITY SCHOOL OF MEDICINE   (China)

Author keywords

Blood vessel; Cryopreservation; Fracture; Thermal stress

Indexed keywords

EID: 0035308118     PISSN: 10069321     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (11)

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