Electrochemistry of the SUCOPLATE® electroplating bath for the deposition of a Cu-Zn-Sn alloy Part I: Commercial bath

Journal of Applied Electrochemistry

Volumn 31, Issue 4, 2001, Pages 387-394

  Picincu, L ^a   Pletcher, D ^a   Smith, A ^b  

^a UNIVERSITY OF SOUTHAMPTON   (United Kingdom)

^b HUBER SUHNER AG   (Switzerland)

Author keywords

Alloy deposition; Bath components; Cu Zn Sn; Electroplating

Indexed keywords

COMPOSITION; COPPER ALLOYS; CYANIDES; ELECTROCHEMISTRY; ELECTRON MICROSCOPY; ELECTROPLATING; MASS TRANSFER; REACTION KINETICS;

ELECTROPLATING BATHS; VOLTAMMETRIC TECHNIQUES;

ELECTROPLATING SOLUTIONS;

EID: 0035306697     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1017599113191     Document Type: Article

References (7)

1. A. Brenner, 'Electrodeposition of Alloys', Volumes I and II, Academic Press, New York, (1963).
2. F.A. Lowenheim (Ed), 'Modern Electroplating', Wiley Interscience, New York, (1974).
3. M. Jordan, 'The Electrodeposition of Tin and its Alloys', Eugen G. Leuze, Saulgau/Würtz, Germany, (1995).
4. 'Canning Handbook on Electroplating', 21st edn, W. Canning & Co, Birmingham, (1970).
5. D. Pletcher and F.C. Walsh, 'Industrial Electrochemistry', 2nd edn, Chapman & Hall, London, (1990).
6. Huber & Suhner Ltd, Technical Literature.
7. L. Picincu, D. Pletcher and A. Smith, J. Appl. Electrochem., this issue.