Wide-bandwidth millimeter-wave bond-wire interconnects

IEEE Transactions on Microwave Theory and Techniques

Volumn 49, Issue 4 I, 2001, Pages 715-718

  Budka, T P ^a  

^a RF Micro Devices   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOND-WIRE INTERCONNECTS;

BANDWIDTH; INSERTION LOSSES; INTERCONNECTION NETWORKS; LOW PASS FILTERS; MICROSTRIP DEVICES; MILLIMETER WAVES; SIMULATORS; SUBSTRATES;

MICROWAVE CIRCUITS;

EID: 0035305928     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.915447     Document Type: Article

References (3)

1. G. L. Matthaei, L. Young, and E. M. T. Jones, Microwave Filters, Impedance-Matching Networks, and Coupling Structures. Norwood, MA: Artech House, 1980.
2. D. M. Pozar, Microwave Engineering. Reading, MA: Addison- Wesley, 1990.
3. T. Krems, W. Haydl, H. Massler, and J. Rudiger, "Millimeter-wave performance of chip interconnections using wire bonding and flip chip," in IEEE MTT-S Int. Microwave Symp. Dig., vol. 1, 1996, pp. 247-250.