Advanced metrology for rapid characterization of the thermal mechanical properties of low-k dielectric and copper thin films

Journal of Electronic Materials

Volumn 30, Issue 4, 2001, Pages 299-303

  Lau, S H ^a   Tolentino, Ellie ^a   Lim, Yuen ^a   Tolentino, Evangeline ^a   Koo, Ann ^a  

^a Frontier Semiconductor   (United States)

Author keywords

Cu; Low k materials; Metrology

Indexed keywords

ADHESION; ANNEALING; ATOMIC FORCE MICROSCOPY; COPPER; FRACTURE TOUGHNESS; HYSTERESIS; OPTICAL MICROSCOPY; PHASE TRANSITIONS; THERMAL EXPANSION; THIN FILMS; X RAY PHOTOELECTRON SPECTROSCOPY;

MODIFIED EDGE LIFT OFF TEST (MELT) PRINCIPLE; THERMAL DESORPTION SPECTROSCOPY (TDS);

DIELECTRIC FILMS;

EID: 0035305264     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-001-0034-y     Document Type: Article

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