Optimization of the preplating processes in the fabrication of electrolessly tin-coated copper tube

Journal of Materials Engineering and Performance

Volumn 10, Issue 2, 2001, Pages 157-163

  Huttunen, E ^a   Tiainen, T ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

Cleaning; Copper tube; Electroless tin coatings; Pickling; Preplating processes; Surface

Indexed keywords

ADHESION; CONTACT ANGLE; COPPER; NUCLEATION; PICKLING; SCANNING ELECTRON MICROSCOPY; SURFACES; TUBES (COMPONENTS);

COPPER TUBE; ELECTROLESSLY TIN COATINGS; PREPLATING PROCESSES;

ELECTROLESS PLATING;

EID: 0035305131     PISSN: 10599495     EISSN: None     Source Type: Journal    
DOI: 10.1361/105994901770345169     Document Type: Article

References (12)

1. Complying with the Stage 1D/DBP Rule