Creep behavior of TiBw/Ti in-situ composite fabricated by reactive hot pressing

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 32, Issue 4, 2001, Pages 1019-1022

  Ma, Z Y ^a   Tjong, S C ^a   Li, S X ^b  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b INSTITUTE OF METAL RESEARCH   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; CREEP TESTING; CRYSTAL LATTICES; CRYSTAL WHISKERS; DIFFUSION; ELASTIC MODULI; HOT PRESSING; STRESS ANALYSIS; THERMAL EFFECTS;

LATTICE DIFFUSION; REACTIVE HOT PRESSING;

METALLIC MATRIX COMPOSITES;

EID: 0035303519     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-001-0359-4     Document Type: Article

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