Experimental study of optimum spacing problem in the cooling of simulated electronic package

Heat and Mass Transfer/Waerme- und Stoffuebertragung

Volumn 37, Issue 2-3, 2001, Pages 251-257

  Chen, S ^a   Liu, Y ^a   Chan, S F ^a   Leung, C W ^a   Chan, T L ^a  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; ELECTRONICS PACKAGING; MATHEMATICAL MODELS; NUSSELT NUMBER; PRANDTL NUMBER; SURFACE PROPERTIES; TEMPERATURE DISTRIBUTION; THERMAL CONDUCTIVITY; THERMAL EFFECTS;

OPTIMUM SPACING PROBLEM;

HEAT TRANSFER;

EID: 0035302640     PISSN: 09477411     EISSN: None     Source Type: Journal    
DOI: 10.1007/s002310000168     Document Type: Article

References (22)

1. Incropera FP (1988) Convection heat transfer in electronic equipment cooling. J Heat Transfer 110: 1097-1111
2. Kennedy KJ; Zebib A (1983) Combined free and forced convection between horizontal parallel plates: some case studies. Int J Heat Mass Transfer 26: 471-474
3. Mahaney HV; Incropera FP; Ramadhyani S (1990) Comparison of predicted and measured mixed convection heat transfer from an array of discrete sources in a horizontal rectangular channel. Int J Heat Mass Transfer 33: 1233-1245
4. Maughan JR; Incropera FP (1990) Regions of heat transfer enhancement for laminar mixed convection in a parallel plate channel. Int J Heat Mass Transfer 33: 555-570
5. Maughan JR; Incropera FP (1991) Use of vortex generators and ribs for heat transfer enhancement at the top surface of a uniformly heated horizontal channel with mixed convection flow. ASME J Heat Transfer 113: 504-507
6. Rang BH; Jaluria Y; Tewari SS (1988) Mixed convection air cooling of an isolated rectangular heat source module on a horizontal plate. ASME Proc Nat Heat Transfer Conf, 59-66
7. Bratten ME; Patankar SV (1980) Analysis of laminar mixed convection in shrouded arrays of heated rectangular blocks. Int J Heat Mass Transfer 28: 1699-170
8. Kim SY; Sung HJ; Hyun JM (1992) Mixed convection from multiple-layered boards with cross-streamwise periodic boundary conditions. Int J Heat Mass Transfer 35: 2941-2952
9. Papanicolaou E; Jaluria Y (1991) Forced and mixed convective cooling of multiple electronic components in an enclosure. Proc ASME/AIChE Nat Conf HTD-171, 29-37
10. Elpidorou D; Prasad V; Modi V (1991) Convection in a vertical channel with a finite wall heat source. Int J Heat Mass Transfer 34: 573-578
11. Naito E; Nagano Y (1989) Combined forced and free upward-flow convection in the entrance region between inclined parallel plates. ASME J Heat Transfer 111: 675-682
12. Lin JT; Armaly BF; Chen TS (1991) Mixed convection heat transfer in inclined backward-facing step flow. Int J Heat Mass Transfer 34: 1568-1571
13. Shaw HJ; Chen WL; Chen CK (1991) Study on the laminar mixed convective heat transfer in three-dimensional channel with a thermal source. ASME J Electron Packaging 113: 40-49
14. Papanicolaou E; Jaluria Y (1992) Transition to a periodic regime in mixed convection in a square cavity. J Fluid Mech 239: 489-509
15. Papanicolaou E; Jaluria Y (1993) Mixed convection from a localized heat source in a cavity with conducting walls: a numerical study. Num Heat Transfer, Part A 23: 463-484
16. Choi CY; Ortega A (1993) Mixed convection in an inclined channel with a discrete heat source. Int J Heat Mass Transfer 36: 3119-3134
17. Huang CC; Lin TF (1994) Buoyancy induced flow transition in mixed convective flow of air through a bottom heated horizontal rectangular duct. Int J Heat Mass Transfer 37: 1235-1255
18. Karki KC; Sathyamurthy PS; Patankar SV (1994) Laminar mixed convection in a horizontal semicircular duct with axially nonuniform thermal boundary condition on the flat wall. Num Heat Transfer, Part A 25: 171-189
19. Leung CW; Kang HJ (1998) Convective heat transfer from simulated air-cooled printed-circuit board assembly on horizontal or vertical orientation. Int Comm Heat Mass Transfer 25: 67-80
20. Choi CY; Kim SJ (1996) Conjugate mixed convection in a channel: modified five percent deviation rule. Int J Heat Mass Transfer 39: 1223-1234
21. Liu Y; Leung CW; Chan TL; Phan-Thien N (1999) An optimum spacing problem for five chips on a horizontal substrate in an enclosure - Natural Convection. Int J Comput Eng Sci (in press)
22. Liu Y; Phan-Thien N; Leung CW; Chan TL (1999) An optimum spacing problem for five chips on a horizontal substrate in a vertically insulated enclosure. Comput Mech 24: 310-317