Miniaturization of chip inductors using multilayer technology and its application as chip components for high frequency power modules

Industrial Ceramics

Volumn 21, Issue 1, 2001, Pages 26-28

  Fujimoto, M ^a   Naoto, N ^a   Nakazawa, M ^a   Kamiyama, Y ^a   Sekiguchi, S ^a   Takahashi, H ^a  

^a TAIYO YUDEN CO LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CELLULAR RADIO SYSTEMS; CHIP SCALE PACKAGES; LASER ABLATION; MINIATURE INSTRUMENTS; MULTILAYERS;

CHIP INDUCTORS;

ELECTRIC INDUCTORS;

EID: 0035301455     PISSN: 11217588     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (2)

1. Counterplot of electromagnetic interface and intelligent materiais
2. Inner-stress induced by Cu metal precipitation at grain boundaries in low-temperature fired Ni-Zn-Cu ferrite