Strength of nanoscale polycrystalline copper under shear

Philosophical Magazine A: Physics of Condensed Matter, Structure, Defects and Mechanical Properties

Volumn 81, Issue 4, 2001, Pages 957-970

  Heino, P ^a   Ristolainen, E ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELASTIC MODULI; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MOLECULAR DYNAMICS; NANOSTRUCTURED MATERIALS; SHEAR STRENGTH; TENSILE STRENGTH;

POLYCRYSTALLINE COPPER;

POLYCRYSTALLINE MATERIALS;

EID: 0035297864     PISSN: 01418610     EISSN: None     Source Type: Journal    
DOI: 10.1080/01418610108214329     Document Type: Article

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