Top surface imaging improves copper process resolution

Solid State Technology

Volumn 44, Issue 3, 2001, Pages 77-78+80+82

  Gadson, B ^a   Lassig, S ^a   Tran, N ^a   Ni, T ^a  

^a Tactical Fabs Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; IMAGING TECHNIQUES; MASKS; OXYGEN; PLASMA ETCHING; SILICA;

DUAL-DAMASCENE PROCESSES; TOP SURFACE IMAGING;

INTEGRATED CIRCUIT LAYOUT;

EID: 0035276479     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (2)

1. Dual-damascene architectures evaluation for 0.18μm technology and below
2. Applying a thin imaging resist system to substrates with topography