Etching of silicon carbide for device fabrication and through via-hole formation

Journal of Electronic Materials

Volumn 30, Issue 3, 2001, Pages 212-219

  Khan, F A ^a   Roof, B ^a   Zhou, L ^a   Adesida, I ^a  

^a University of Illinois at Urbana Champaign   (United States)

Author keywords

Etching; Silicon carbide; Surface damage; Via hole

Indexed keywords

CHLORINE; FABRICATION; MACHINING; MICROELECTRONICS; MIXTURES; PLASMA ETCHING; SEMICONDUCTING SILICON COMPOUNDS; SURFACE STRUCTURE;

SULFUR FLUORIDE; SURFACE DAMAGE; VIA-HOLE FORMATION;

SILICON CARBIDE;

EID: 0035275417     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-001-0018-y     Document Type: Article

References (11)