Metallic Cu coating on HTS surfaces using electrochemical preparation

IEEE Transactions on Applied Superconductivity

Volumn 11, Issue 1 III, 2001, Pages 2838-2841

  Floegel Delor, U ^a   Rothfeld, R ^a   Wippich, D ^a   Riedel, T ^a   Werfel, F ^a  

^a Adelwitz Technologiezentrum GmbH   (Germany)

Author keywords

Cu deposition; HTS bulk; Interface structure; Metal contact

Indexed keywords

COPPER; CORROSION; DEGRADATION; DEPOSITION; ELECTRIC CONDUCTIVITY; ELECTRIC FAULT CURRENTS; ELECTRIC PROPERTIES; MICROSCOPIC EXAMINATION; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; THERMODYNAMIC PROPERTIES; YTTRIUM BARIUM COPPER OXIDES;

ELECTROCHEMICAL DEPOSITION; INTERFACE STRUCTURE; METAL CONTACT;

HIGH TEMPERATURE SUPERCONDUCTORS;

EID: 0035268236     PISSN: 10518223     EISSN: None     Source Type: Journal    
DOI: 10.1109/77.919653     Document Type: Conference Paper

References (5)

1. 7 ceramic composites
2. Key design issues of YBCO current leads: Low resistance contacts
3. Quench protection of 13 kA HTS prototype leads for LHC
4. c bulk material for ist use in resistive superconducting fault current limiters