Solid-state diffusion bonding of Inconel alloy 718 to 17-4 PH stainless steel

Materials and Manufacturing Processes

Volumn 16, Issue 2, 2001, Pages 265-279

  Guoge, Zhang ^a   Chandel, R S ^a   Seow, H P ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Bonding pressure; Diffusion bonding; Finite element modeling; Inconel alloy 718; Intermetallic film; Joining; Joint quality; Mechanical property; Mechanical test; Metallographic examination; Microstructure; Processing parameter; Residual stress; Solid state; Stainless steel

Indexed keywords

BONDING; DIFFUSION; DUCTILITY; FAILURE (MECHANICAL); FINITE ELEMENT METHOD; INTERFACES (MATERIALS); INTERMETALLICS; JOINTS (STRUCTURAL COMPONENTS); MECHANICAL TESTING; PRESSURE; RESIDUAL STRESSES; TEMPERATURE;

BONDING PRESSURE; DIFFUSION BONDING; INCONEL ALLOY; INTERMETALLIC FILM; METALLOGRAPHIC EXAMINATION; PROCESSING PARAMETER;

STAINLESS STEEL;

EID: 0035265799     PISSN: 10426914     EISSN: None     Source Type: Journal    
DOI: 10.1081/AMP-100104305     Document Type: Article

References (6)