Formation of Ti-Cu intermetallic coatings on copper substrate

Materials and Manufacturing Processes

Volumn 16, Issue 2, 2001, Pages 219-228

  Bateni, M R ^a   Mirdamadi, S ^a   Ashrafizadeh, F ^b   Szpunar, J A ^c   Drew, R A L ^c  

^a IRAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Iran)

^b ISFAHAN UNIVERSITY OF TECHNOLOGY   (Iran)

^c MCGILL UNIVERSITY   (Canada)

Author keywords

Coatings; Compositional gradient; Copper; Diffusion annealing; Diffusion coatings; Hardness gradient; Inward diffusion; Physical vapor

Indexed keywords

ANNEALING; COPPER; ENERGY DISPERSIVE SPECTROSCOPY; INTERMETALLICS; MICROHARDNESS; PHASE TRANSITIONS; PHYSICAL VAPOR DEPOSITION; SCANNING ELECTRON MICROSCOPY; SOLID SOLUTIONS; STRUCTURE (COMPOSITION); SURFACE PROPERTIES; X RAY DIFFRACTION ANALYSIS;

COMPOSITIONAL GRADIENT; DIFFUSION ANNEALING; ELECTRON PROBE MICROANALYSIS; HARDNESS GRADIENT; INWARD DIFFUSION;

COATINGS;

EID: 0035265707     PISSN: 10426914     EISSN: None     Source Type: Journal    
DOI: 10.1081/AMP-100104302     Document Type: Article

References (19)

1. Application of graded ceramic coatings for thermal barriers
2. Pack aluminization of copper
3. Aluminization of copper for oxidation protection
4. Silicon coatings on copper by chemical vapor deposition in fluidized bed reactors
5. The Cu-Ti (copper-titanium) system
6. Structural characterization of novel Ti-Cu intermetallic coatings
7. Experiences from scratch testing of tribological PVD coatings
8. Experts reveal trends in PVD processes and applications
9. Cementation as a method of observing defects in PVD coatings
10. Intermetallic coatings for high temperatures application
11. Wear of binary alloys-difference in wear mode between solid solution and intermetallic compounds
12. Eutectoid decomposition mechanisms in hypoeutectoid Ti-X alloys
13. Atomic force microscopy imaging of the growth features on the surface of rutile