Comparison of material removal rate models and experimental results for the double-sided polishing process

Journal of Materials Processing Technology

Volumn 109, Issue 3, 2001, Pages 248-253

  Klamecki, Barney E ^a  

^a University of Minnesota   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MATHEMATICAL MODELS; PROCESS CONTROL; SLURRIES;

DOUBLE-SIDED POLISHING; MATERIAL REMOVAL RATE;

POLISHING;

EID: 0035254718     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-0136(00)00806-2     Document Type: Article

References (7)

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2. Klamecki B.E. Characterization of the double sided polishing process. Adv. Inform. Storage Syst. 6:1995;177-191.
3. Aghan R.L., Samuels L.E. Mechanisms of abrasive polishing. Wear. 16:1970;293-310.
4. Siekman J.G. Polishing of brittle amorphous alloys. Wear. 117:1987;359-374.
5. Salje E. Relations between abrasive processes. Ann. CIRP. 37:1988;641-648.
6. Brown N.J. Some speculations on the mechanisms of abrasive grinding and polishing. Prec. Eng. 9:1987;129-138.
7. Phillips K., Crimes G.M., Wilshaw T.R. On the mechanism of material removal by free abrasive grinding of glass and fused silica. Wear. 41:1977;327-350.