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Journal of Applied Polymer Science

Volumn 79, Issue 8, 2001, Pages 1359-1370

New epoxy/episulfide resin system for electronic applications. I. Curing mechanism and properties

(2) Tsuchida, Katsuyuki a Bell, James P a

a UNIVERSITY OF CONNECTICUT (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CHEMICAL BONDS; COPPER; CURING; PERMITTIVITY; THERMAL EXPANSION; WATER ABSORPTION;

DICYANDIAMIDE; EPISULFIDE; THERMAL EXPANSION COEFFICIENT;

EPOXY RESINS;

EID: 0035252492 PISSN: 00218995 EISSN: None Source Type: Journal
DOI: 10.1002/1097-4628(20010222)79:8<1359::AID-APP30>3.0.CO;2-N Document Type: Article

Times cited : (13)

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