Multi-electrode CZT detector packaging using polymer flip chip bonding

Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Volumn 458, Issue 1-2, 2001, Pages 511-517

  Jordanov, Valentin T ^a   MacRi, John R ^b   Clayton, James E ^c   Larson, Kipp A ^b  

^a Yantra   (United States)

^b UNIVERSITY OF NEW HAMPSHIRE   (United States)

^c Polymer Flip Chip Corp   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRODES; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; SEMICONDUCTING CADMIUM TELLURIDE;

POLYMER FLIP CHIP BONDING;

PARTICLE DETECTORS;

EID: 0035250745     PISSN: 01689002     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0168-9002(00)00912-8     Document Type: Article

References (11)

1. Egarievwe S.U.et al. J. X-Ray Sci. Technol. 6:1996;309.
2. Stahle C.M.et al. MRS Symp. Proc. 487:1998;257.
3. Matherson K.J.et al. IEEE Trans. Nucl. Sci. NS-45(3):1998;354.
4. Kulesza F.W., Estes R.H. Adv. Packaging. 6:1997;26.
5. U.S. Patent #5,074,947, December 1991.
6. T. LeClair et al., Proceedings of the International Symposium on Microelectronics (IMAPS), 1998 p. 758.
7. Jordanov V.T., Macri J.R., Mayer M.L. IEEE Trans. Nucl. Sci. NS-45(3):1998;787.
8. Hamel L.A.et al. MRS Symp. Proc. 487:1998;211.
9. M.L. Cherry et al., Proceedings 24th International Cosmic Ray Conference Rome, August, 1995.
10. A. Zych et al., Proceedings of the Second INTEGRAL Workshop, European Space Agency (ESA), vol. SP-382, 1997, p. 367.
11. O. Tousignant et al., Presentation at SPIE Meeting, Denver, CO, 1999.