A method of investigating fine shorting whiskers within a leadframe molded package

IEEE Transactions on Advanced Packaging

Volumn 24, Issue 1, 2001, Pages 99-103

  Yen, Andrew C ^a   Hongyu, Zheng ^b   Wynn, Richard Thet ^a   Yaohui, Zhang ^c   Wang, Lingfai ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b Motorolla   (China)

^c SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Electric shorts; Hybrid integrated circuit; Packaged modules; Whiskers

Indexed keywords

EXCIMER LASER ETCHING; FINE WHISKERS; LEADFRAME MOLDED PACKAGE; MECHANICAL MILLING;

AUGER ELECTRON SPECTROSCOPY; CRYSTAL WHISKERS; ETCHING; EXCIMER LASERS; HYBRID INTEGRATED CIRCUITS; MILLING (MACHINING); MULTICHIP MODULES; SHORT CIRCUIT CURRENTS; SOLDERING;

ELECTRONICS PACKAGING;

EID: 0035248187     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.909632     Document Type: Article

References (6)

1. Plastic mold decapsulation system
2. Laser etching section
3. Excimer lasers: Current and future applications in industry and medicine
4. Auger and x-ray photoelectron spectroscopy
5. Private communication: Industrial dialogue