A structure and property based process window for void free thermoset composites

Polymer Composites

Volumn 22, Issue 1, 2001, Pages 22-31

  Eom, Yongsung ^a   Boogh, Louis ^a   Michaud, Veronique ^a   Manson, Jan Anders ^a  

^a EPFL   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

CALCULATIONS; CURING; OPTIMIZATION; PLASTIC LAMINATES; PRESSURE EFFECTS; RESIDUAL STRESSES; RESINS; SHRINKAGE; STRUCTURE (COMPOSITION); THERMOSETS; VISCOELASTICITY;

FIBER VOLUME FRACTION; MATRIX SHRINKAGE; PROCESS WINDOW BOUNDARY; VOID FREE THERMOSET COMPOSITE;

COMPOSITE MATERIALS;

EID: 0035244879     PISSN: 02728397     EISSN: None     Source Type: Journal    
DOI: 10.1002/pc.10512     Document Type: Article

References (12)

1. Stress-initiated void formation in a three-dimensionally constrained epoxy resin during cure