X-ray analysis of the defect structure in Cu subjected to severe plastic deformation

Materials Science Forum

Volumn 378-381, Issue II, 2001, Pages 457-462

  Kilmametov, A R ^a   Zhang, K ^a   Alexandrov, I V ^a   Mazitov, R M ^a   Lu, K ^a  

^a Science and Education Center of Bashkir People History Ufa University of Science and Technology   (Russian Federation)

Author keywords

Grain boundaries; Nanostructured materials; Severe plastic deformation; X ray analysis

Indexed keywords

DEFECTS; NANOSTRUCTURED MATERIALS; PLASTIC DEFORMATION; TEMPERATURE; THERMAL EXPANSION; ULTRASONIC APPLICATIONS; X RAY ANALYSIS;

DEFECT STRUCTURE; SEVERE PLASTIC DEFORMATION; THERMAL EXPANSION COEFFICIENT;

COPPER;

EID: 0035177943     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/msf.378-381.457     Document Type: Conference Paper

References (20)

1. Ultrafine grained materials produced by severe plastic deformation