Improvement of 300mm FOUP mini-environment

IEEE International Symposium on Semiconductor Manufacturing Conference, Proceedings

Volumn , Issue , 2001, Pages 503-506

  Seita, Hisaharu ^a   Fujii, Atsuhiro ^a   Suzuki, Tatsuya ^a   Kimoto, Shinyo ^a   Shippou, Osamu ^a   Fujiwara, Keiji ^a   Tokunaga, Kenji ^a  

^a SEMICONDUCTOR LEADING EDGE TECHNOLOGIES INC   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CONTAMINATION; DEFORMATION; DRYING; DUST; ENVIRONMENTAL TESTING; INTEROPERABILITY; SILICON WAFERS;

FRONT OPENING UNIFIED POD (FOUP); MINI-ENVIRONMENT;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0035174937     PISSN: 1523553X     EISSN: None     Source Type: Journal    
DOI: 10.1109/ISSM.2001.963025     Document Type: Article

References (4)

1. Particle characteristics of 300mm mini-environment (FOUP LPU)
2. Expectation and the problem of mini-environment