Fast subpixel digital image correlation using artificial neural networks

IEEE International Conference on Image Processing

Volumn 2, Issue , 2001, Pages 901-904

  Pitter, M C ^a   See, C W ^a   Somekh, M G ^a  

^a UNIVERSITY OF NOTTINGHAM   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

CORRELATION METHODS; CURVE FITTING; DEFORMATION; ELECTRON DEVICES; MULTILAYER NEURAL NETWORKS; THERMAL STRESS;

MICROELECTRONICS DEVICES; SUBPIXEL;

IMAGE PROCESSING;

EID: 0035173276     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Thermal challenges in the telecom and networks industry
2. MicroDAC - A novel approach to measure in situ deformation fields of microscopic scale
3. Recent advances of moiré and microscopic moiré interferometry for thermal deformation analyses of microelectronic devices
4. Electronic speckle photography: Increased accuracy by nonintegral pixel shifting