Assessing circuit level impact of self-heating in 0.13μm SOI CMOS

IEEE International SOI Conference

Volumn , Issue , 2001, Pages 101-102

  Sinha, S P ^a   Pelella, M ^a   Tretz, C ^a   Riccobene, C ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; COMPUTER SIMULATION; HEAT LOSSES; OPTIMIZATION; SILICON ON INSULATOR TECHNOLOGY; THERMAL CONDUCTIVITY; THERMAL EFFECTS;

SELF-HEATING; THREE DIMENSIONAL SIMULATIONS;

CMOS INTEGRATED CIRCUITS;

EID: 0035171952     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)