Advanced EB-cure process and equipment for Low-k Dielectric

IEEE International Symposium on Semiconductor Manufacturing Conference, Proceedings

Volumn , Issue , 2001, Pages 325-328

  Onishi, Tadash ^a   Nagaseki, Kazuya ^a   Shimada, Miyoko ^a,b   Miyajima, Hideshi ^a,b   Nakata, Rempei ^a,b   Yamaguchi, Masanori ^a,c   Murase, Jun ^a,c   Hata, Hiroshige ^a,c  

^a TOKYO ELECTRON LTD   (Japan)

^b TOSHIBA CORPORATION   (Japan)

^c USHIO INC   (Japan)

Author keywords

Cure; EB; Low k dielectric

Indexed keywords

CHEMICAL MECHANICAL POLISHING; CURING; DIELECTRIC MATERIALS; ELECTRIC CHARGE; ELECTRON BEAMS; WSI CIRCUITS;

BATCH SIZE PROCESSING;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0035161203     PISSN: 1523553X     EISSN: None     Source Type: Journal    
DOI: 10.1109/ISSM.2001.962978     Document Type: Article

References (3)

1. Low-k dielectrics characterization for damascene integration
2. High-performance Low-k dielectric using advanced EB-cure process
3. New low k material "LKD™" for Al damascene process application