Microstructural characterization of electroconductive Si3N4-TiN composites

Materials Letters

Volumn 47, Issue 1-2, 2001, Pages 71-76

  Lee, Byong Taek ^a   Yoon, Yeu Joo ^a   Lee, Kap Ho ^b  

^a Kongju National University   (South Korea)

^b Chungnam National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CONDUCTIVE MATERIALS; ELECTRIC CONDUCTIVITY; FRACTURE TOUGHNESS; GRAIN GROWTH; POWDERS; SILICON NITRIDE; SINTERING; TITANIUM NITRIDE;

ELECTROCONDUCTIVE COMPOSITES;

CERAMIC MATRIX COMPOSITES;

EID: 0035151137     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-577X(00)00214-7     Document Type: Article

References (10)

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