A one-dimensional thermal model for planar integrated reactive modules

Conference Record - IAS Annual Meeting (IEEE Industry Applications Society)

Volumn 4, Issue , 2001, Pages 2211-2216

  Zhao, L ^a   Odendaal, W G ^a   Strydom, J T ^a   Van Wyk, J D ^a  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; COMPUTER SIMULATION; ELECTRIC REACTANCE MEASUREMENT; ELECTRIC VARIABLES CONTROL; ONE DIMENSIONAL; SEMICONDUCTOR DEVICE MODELS; TEMPERATURE MEASUREMENT;

ONE DIMENSIONAL THERMAL MODEL; PLANAR INTEGRATED REACTIVE MODULES;

POWER INTEGRATED CIRCUITS;

EID: 0035148796     PISSN: 01972618     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Some present and future trends in power electronic converters
2. Some limits of integrated L-C-T modules for resonant converters at 1MHz
3. Technology for manufacture of integrated planar LC structures for power electronic applications
4. Design considerations for an integrated LC resonant module
5. Optimization and design of integrated series resonant module
6. Simple approximations of the DC biasing field on the core loss of power ferrites and their use in design of magnetic components