Formation of large area Al contacts on 6H- and 4H-SiC substrates

Materials Science Forum

Volumn 353-356, Issue , 2001, Pages 603-606

  Korolkov, O ^a   Rang, T ^a  

^a TALLINN UNIVERSITY OF TECHNOLOGY   (Estonia)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ALUMINUM; BOND STRENGTH (MATERIALS); CURRENT VOLTAGE CHARACTERISTICS; ELECTRIC CONTACTS; ELECTRIC RESISTANCE; SUBSTRATES; WELDING;

DIFFUSION WELDING; SCHOTTKY CONTACT; SPECIFIC CONTACT RESISTANCE;

SILICON CARBIDE;

EID: 0035122923     PISSN: 02555476     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.4028/www.scientific.net/msf.353-356.603     Document Type: Article

References (4)

1. O. Korolkov, T. Rang: Proc. 6th Baltic Electronics Conference (BEC'98), Tallinn, Estonia, Oct. 7-9, 1998, 251-252.
2. T. Rang, O. Korolkov, R. Kurel, and M. Pikkov: In "Materials Mechanics Fracture Mechanics Micro Mechanics", Eds. T. Winkler, A. Schubert, Druckhaus Dresden GmbH, Germany, 1999, 574-579.
3. H.H. Berger: J. Electrochem. Soc., vol 119, No 4, 1972, 507-514.
4. G. Nakamara, H. Shimada and M. Satoh: Abstracts of International Conference on Silicon Carbide and Related Materials. (ICSCRM'99 Sheraton Imperial Center, Research Triangle Park, NC, 10-15 Oct. 1999), 44.