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Volumn 58, Issue 3, 2001, Pages 111-116
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Dynamic viscoelastic behaviors of hydrogen silsesquioxane resin at high temperatures
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Author keywords
Air; Cure; Dynamic viscoelasticy; Hydrogen Silsesquioxane; Loss modulus; Melt; Nitrogen; Oxygen; Preheat; Storage modulus
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Indexed keywords
AIR;
CURING;
MELTING;
NITROGEN;
PLASTIC FILMS;
SEMICONDUCTING FILMS;
THERMAL EFFECTS;
VISCOELASTICITY;
HYDROGEN SILSESQUIOXANE RESINS;
RESINS;
VISCOELASTICITY;
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EID: 0035068248
PISSN: 03862186
EISSN: None
Source Type: Journal
DOI: 10.1295/koron.58.111 Document Type: Article |
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Times cited : (2)
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References (3)
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